Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
December 15, 2009
Patent Application Number
10732181
Date Filed
December 9, 2003
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor package includes a lead frame having a plurality of leads and a lead frame pad, the lead frame pad including a die coupled thereto, at least one of the plurality of leads having an external portion sloped upwards relative to a bottom surface of the package, metal connectors connecting the die to the plurality of leads, and a resin body encapsulating the die, metal connectors and at least a portion of the lead frame.
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