Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
December 22, 2009
Patent Application Number
12504189
Date Filed
July 16, 2009
Patent Primary Examiner
Patent abstract
Chemical mechanical polishing pads are provided, wherein the chemical mechanical polishing pads have a polishing layer comprising an interpenetrating network including a continuous non-fugitive phase and a substantially co-continuous fugitive phase. Also provided are methods of making the chemical mechanical polishing pads and for using them to polish substrates.
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