Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
William E. Davis0
Bharat M. Mangrolia0
Kalu K. Vasoya0
Richard A. Bohner0
Date of Patent
December 22, 2009
0Patent Application Number
109216490
Date Filed
August 18, 2004
0Patent Primary Examiner
Patent abstract
Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.
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