US Patent 7637411 Wire bonding apparatus and process
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Patent Inventor Names
Richard D. Sadler0
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Patent abstract
A wire bonding machine includes (1) a support structure for supporting a work piece and (2) a pre-heat structure for supporting the work piece during a pre-heat operation. The pre-heat structure is moveable with respect to the support structure.
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US Patent 07637411 Wire bonding apparatus and process US Patent 7637411 Wire bonding apparatus and process
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Patent Number
076374110
Patent Number
76374110
Edits on 27 Sep, 2022
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Patent Jurisdiction
Patent Number
076374110
Date of Patent
December 29, 2009
0Patent Application Number
121984220
Date Filed
August 26, 2008
0Official Website
Patent Primary Examiner
Edits on 18 Jun, 2022
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US Patent 07637411 Wire bonding apparatus and process
Infobox
Is a
Patent jurisdiction
Patent number
07637411
Date of patent
December 29, 2009
Patent application number
12198422
Date Filed
August 26, 2008
Patent primary examiner
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