US Patent 7638862 Die attach paddle for mounting integrated circuit die
Patent 7638862 was granted and assigned to Atmel Corporation on December, 2009 by the United States Patent and Trademark Office.
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An electrical package for an integrated circuit die which comprises a die-attach paddle for mounting the integrated circuit die. The die-attach paddle has at least one down-set area located on a periphery of the die-attach paddle. The down-set area has an upper surface and a lower surface, with the upper surface configured to electrically couple a first end of a first electrically conductive lead wire. A second end of the first electrically conductive lead wire is bonded to the integrated circuit die. The upper surface is further configured to electrically couple a first end of a second electrically conductive lead wire and a second end of the second electrically conductive lead wire is bonded to a lead finger of the electrical package.
US Patent 07638862 Die attach paddle for mounting integrated circuit die US Patent 7638862 Die attach paddle for mounting integrated circuit die
US Patent 07638862 Die attach paddle for mounting integrated circuit die
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