US Patent 7640655 Electronic component embedded board and its manufacturing method
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Patent abstract
A second substrate 12 is provided above a first substrate 11, and an electronic component 13 is arranged between the first substrate 11 and the second substrate 12 so that between the first substrate 11 and the second substrate 12, the electronic component 13 is sealed and a photosensitive resin 14 having adhesion is provided to bond the first substrate 11 and the second substrate 12 to each other.
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Patent Inventor Names
Masahiro Sunohara0
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US Patent 07640655 Electronic component embedded board and its manufacturing method US Patent 7640655 Electronic component embedded board and its manufacturing method
Infobox
Patent Number
076406550
Patent Number
76406550
Edits on 28 Sep, 2022
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Patent Jurisdiction
Patent Number
076406550
Date of Patent
January 5, 2010
0Patent Application Number
115191250
Date Filed
September 12, 2006
0Official Website
Patent Primary Examiner
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US Patent 07640655 Electronic component embedded board and its manufacturing method
Infobox
Is a
Patent jurisdiction
Patent number
07640655
Date of patent
January 5, 2010
Patent application number
11519125
Date Filed
September 12, 2006
Patent primary examiner
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