Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
January 5, 2010
Patent Application Number
10542537
Date Filed
January 23, 2004
Patent Primary Examiner
Patent abstract
A method for fabricating a filtering member in which overlapping portions of a wire are bonded together in a layered manner through thermal treatment for forming a mesh is disclosed. In accordance with the method, a contact surface pressure between portions of the wire to be bonded together is maintained as equal to or higher than a predetermined level set depending on a thermal treatment condition. In this state, the thermal treatment is conducted such that a bonding portion of the wire has a strength equal to or greater than 4N.
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