Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
January 5, 2010
Patent Application Number
10873046
Date Filed
June 21, 2004
Patent Primary Examiner
Patent abstract
A boron-free and silicon-free bonding alloy (16) for joining with a superalloy base material (12, 14). The bonding alloy includes aluminum in a concentration that is higher than the concentration of aluminum in the base material in order to depress the melting temperature for the bonding alloy to facilitate liquid phase diffusion bonding without melting the base material. The concentration of aluminum in the bonding alloy may be at least twice that of the concentration of aluminum in the base material. For joining cobalt-based superalloy materials that do no contain aluminum, the concentration of aluminum in the bonding alloy may be at least 5 wt. %.
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