Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tetsuya Kurosawa0
Date of Patent
January 5, 2010
Patent Application Number
11594196
Date Filed
November 8, 2006
Patent Primary Examiner
Patent abstract
An element is formed on the major surface of a semiconductor wafer, and a groove is formed in the back surface of the semiconductor wafer along a dicing line or chip dividing line by a mechanical or chemical method. A modified layer is formed by irradiating the groove with a laser, and the semiconductor wafer is divided by using the modified layer as a starting point. The back surface of the semiconductor wafer is removed to at least the depth of the groove.
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