Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Takahiro Kasuga0
Date of Patent
January 5, 2010
0Patent Application Number
119518160
Date Filed
December 6, 2007
0Patent Primary Examiner
Patent abstract
A semiconductor device includes: solder balls provided on an upper package; and pads provided on a lower package and directly connected to the solder balls, wherein at least one of the pads serves as a fiducial mark. Further, a shape of at least one of the pads is different from that of other pads and an area of at least one of the pads is substantially equal to that of the other pads.
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