US Patent 7643309 Ruggedized electronics sub-system module
Patent 7643309 was granted and assigned to Rockwell Collins on January, 2010 by the United States Patent and Trademark Office.
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Patent abstract
A ruggedized electronics sub-system module is disclosed. The ruggedized electronics sub-system module includes a ruggedized housing and an electronic sub-system environmentally sealed within the ruggedized housing. At least one electrical interface is configured to couple to an external electrical connector.
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Patent Inventor Names
Steve I. Lebo0
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Patent Citations Received
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Official Website
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US Patent 07643309 Ruggedized electronics sub-system module US Patent 7643309 Ruggedized electronics sub-system module
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Patent Number
07643309
Patent Number
7643309
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US Patent 07643309 Ruggedized electronics sub-system module
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Is a
Current assignee
Patent jurisdiction
Patent number
07643309
Date of patent
January 5, 2010
Patent application number
10198361
Date Filed
July 18, 2002
Patent primary examiner
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