Patent attributes
A method for manufacturing a multilayer chip capacitor includes: forming screen patterns on mother green sheets such that a widthwise margin is not formed on the mother green sheets, the screen patterns are spaced apart from each other in the width direction and the longitudinal direction, and a width of each screen pattern is greater than a spacing between the adjacent screen patterns; forming internal electrode patterns on the mother green sheets; forming a stack of the mother green sheets; forming a capacitor body having internal electrodes by cutting the stack of the mother green sheets along cutting lines arranged in the width direction and the longitudinal direction; forming chip-protecting side members on both sides of the capacitor body such that the chip-protecting side members contact both sides of the internal electrodes, respectively; and forming a pair of terminal electrodes on the outer surface of the capacitor body.
