Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
January 12, 2010
Patent Application Number
11178214
Date Filed
July 8, 2005
Patent Citations Received
Patent Primary Examiner
Patent abstract
Methods and systems are provided for LED modules that include an LED die integrated in an LED package with a submount that includes an electronic component for controlling the light emitted by the LED die. The electronic component integrated in the submount may include drive hardware, a network interface, memory, a processor, a switch-mode power supply, a power facility, or another type of electronic component.
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