Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tsuneo Sato0
Youichi Sawachi0
Atsuhiko Ishihara0
Hiroshi Yamasako0
Naoya Iwata0
Takao Kiuchi0
Date of Patent
January 12, 2010
0Patent Application Number
110914030
Date Filed
March 29, 2005
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A mounting board of a camera module of a mobile phone is screwed to an outer cover through cushions formed of rubber, sponge or the like. A solid state imaging device and an optical unit of the camera module are contained in an opening formed in the outer cover and do not contact the outer cover. The mounting board is connected to a main substrate through a flexible board. Accordingly, even if the mobile phone is dropped down, the camera module is prevented from breakage by the vibration or the shock applied to the mobile phone, because the vibration and the shock are not transmitted to the camera module directly.
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