Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Michael Alvin Rencher0
Charles Evans0
Haoran Duan0
James R. Emmert0
Date of Patent
January 19, 2010
Patent Application Number
11840387
Date Filed
August 17, 2007
Patent Primary Examiner
Patent abstract
A semiconductor die includes a plurality of drivers and a plurality of bonding pads. Each driver is formed by a plurality of interconnected modules and has an associated bonding pad to which at least one of the modules of the driver is electrically connected. The modules of some of the drivers are positioned outside of the associated bonding pad toward a periphery of the die. The bonding pads may be arranged, for example, in a double- or triple-staggered pattern around the periphery of the die.
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