US Patent 7649208 Light emitting diode package including monitoring photodiode
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Patent abstract
The present invention relates to an LED package including photo diode. The LED package includes a silicon substrate, and a photo diode is formed in an upper part thereof. Also, an insulation layer is formed on the silicon substrate excluding at least a light-receiving area of the photodiode. In the LED package, an LED terminal is formed on the insulation layer to be connected to the photo diode. First and second LED connecting pads are formed on the insulation layer, and arranged on both sides of the photo diode. In addition, an LED chip is mounted on the silicon substrate, and connected to the first and second LED connecting pads.
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Patent Inventor Names
Chang Hyun Lim0
Ho Joon Park0
Sang Hyun Choi0
Seog Moon Choi0
Sung Jun Lee0
Woong Lin Hwang0
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US Patent 07649208 Light emitting diode package including monitoring photodiode US Patent 7649208 Light emitting diode package including monitoring photodiode
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Patent Number
076492080
Patent Number
76492080
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Patent Jurisdiction
Patent Number
076492080
Date of Patent
January 19, 2010
0Patent Application Number
113135080
Date Filed
December 21, 2005
0Official Website
Patent Primary Examiner
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US Patent 07649208 Light emitting diode package including monitoring photodiode
Infobox
Is a
Patent jurisdiction
Patent number
07649208
Date of patent
January 19, 2010
Patent application number
11313508
Date Filed
December 21, 2005
Patent primary examiner
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