US Patent 7650931 Vapor augmented heatsink with multi-wick structure
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Patent abstract
A heat transfer device includes a base chamber, a fin chamber, and at least one fin. The chambers can be thermally coupled. The heat transfer device also includes a wick structure. The wick structure can include a multi-wick structure. The multi-wick structure can include a three-dimensional wick structure and/or a spatially varying wick structure.
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Patent Inventor Names
Wing Ming Siu0
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US Patent 07650931 Vapor augmented heatsink with multi-wick structure US Patent 7650931 Vapor augmented heatsink with multi-wick structure
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Patent Number
07650931
Patent Number
7650931
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US Patent 07650931 Vapor augmented heatsink with multi-wick structure
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Is a
Patent jurisdiction
Patent number
07650931
Date of patent
January 26, 2010
Patent application number
12135297
Date Filed
June 9, 2008
Patent primary examiner
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