US Patent 7651889 Electromagnetic shield formation for integrated circuit die package

Patent 7651889 was granted and assigned to Freescale Semiconductor on January, 2010 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Current Assignee

Freescale Semiconductor

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7651889

Date of Patent

January 26, 2010

Patent Application Number

11961827

Date Filed

December 20, 2007

Patent Primary Examiner

‌

Phuc T. Dang

Patent abstract

Electromagnetic shielding for an integrated circuit packaged device. The method includes forming shielding structures by forming openings in an encapsulated structure. The openings are filled with conductive material that surrounds at least one die. The encapsulated structure may include a plurality of integrated circuit die. A layered redistribution structure is formed on one side of the encapsulated structure.

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