Patent 7651920 was granted and assigned to Infineon Technologies on January, 2010 by the United States Patent and Trademark Office.
One or more embodiments describe a method of fabricating a silicon based metal oxide semiconductor device, comprising: implanting a first dopant into a first partial completion of the device, the first dopant comprising a first noise reducing species; and implanting a second dopant into a second partial completion of the device, the second dopant and the first dopant being opposite conductivity types.