Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
January 26, 2010
Patent Application Number
11117726
Date Filed
April 29, 2005
Patent Primary Examiner
Patent abstract
A semiconductor device according to an embodiment of the present invention includes a plurality of chip regions and a plurality of chip rings. The plurality of chip regions include semiconductor integrated circuits each having a multilayered wiring structure using a metal wiring, and are formed into independent chips. The plurality of chip rings has the multilayered wiring structure using the metal wiring, and surround the respective chip regions. The plurality of chip rings are electrically connected to one another.
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