Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hon Shing Eddie Law0
Kam Hong Kenneth Lam0
Wai Lok Ben To0
Wing Cheung James Ho0
Date of Patent
February 2, 2010
Patent Application Number
11858505
Date Filed
September 20, 2007
Patent Primary Examiner
Patent abstract
A wire bonding apparatus and method in which separate first and second positioning tables are provided for mounting electronic devices to be wire bonded, and a bonding tool is provided at a bonding position for bonding the electronic devices. First and second loading/unloading positions are provided for loading electronic devices to or unloading electronic devices from the positioning tables. The first and second positioning tables are operative to move independently of each other, such that the first positioning table is movable between the first loading/unloading position and the bonding position and the second positioning table is movable between the second loading/unloading position and the bonding position.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
