Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
John W. Wood0
Gary Stevens0
James D. B. Smith0
Date of Patent
February 2, 2010
0Patent Application Number
113969890
Date Filed
April 3, 2006
0Patent Primary Examiner
Patent abstract
In one application the mix grafted and non grafted invention provides for high thermal conductivity resin that comprises a host resin matrix with a first class of grafted high thermal conductivity particles that are grafted to the host resin matrix. Also a second class of non-grafted high thermal conductivity particles that are not directly grafted the host resin matrix. The first class and the second class comprise approximately 2-60% by volume of the high thermal conductivity resin. The first class of grafted particles and the second class of non-grafted particles are high thermal conductivity fillers are from 1-1000 nm in length, and have an aspect ratio of between 3-100.
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