Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
February 2, 2010
Patent Application Number
11440342
Date Filed
May 24, 2006
Patent Primary Examiner
Patent abstract
A method, comprising bonding a first wire to a single die bond pad to form a first bond, bonding the first wire to a bond post to form a second bond, bonding a second wire to the first bond, and coupling the second wire to the bond post.
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