Patent attributes
The present invention enhances a manufacturing yield rate relating to through holes. In a display device which includes a first conductive layer formed on a substrate and a second conductive layer which is formed on the first conductive layer by way of insulation films of two or more layers and connects the first conductive layer and the second conductive layer via a through hole, in the through hole portion, a side surface of an opening formed in the insulation film arranged on the first conductive layer side out of the insulation films of two or more layers includes a portion thereof which is covered with the insulation film arranged on the second conductive layer side out of the insulation films of two or more layers and an exposed portion.
