Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 9, 2010
Patent Application Number
12056745
Date Filed
March 27, 2008
Patent Primary Examiner
Patent abstract
A method for evaluating a solder joint portion by means of which a part and a substrate are joined to each other includes a preparation process for preparing the substrate including the solder joint portion, a thermal shock process for applying thermal shock to the solder joint portion multiple times, and an evaluation process for obtaining a change of a crystal grain size in the solder joint portion caused by the application of the thermal shock so as to evaluate a lifespan of the solder joint portion based on the change of the crystal grain size obtained.
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