US Patent 7658988 Printed circuits prepared from filled epoxy compositions
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Patent abstract
Compositions and processes for the preparation of printed circuits from epoxy compositions are provided. The epoxy compositions exhibit low viscosity in the uncured state and low coefficient of thermal expansion in the cured state. The low dielectric constant compositions of the invention are well-suited for use in multi-layer printed circuit boards.
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Patent Inventor Names
George Elias Zahr0
Govindasamy Paramasivam Rajendran0
Pui-Yan Lin0
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US Patent 07658988 Printed circuits prepared from filled epoxy compositions US Patent 7658988 Printed circuits prepared from filled epoxy compositions
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Patent Number
07658988
Patent Number
7658988
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Official Website
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US Patent 07658988 Printed circuits prepared from filled epoxy compositions
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Is a
Patent jurisdiction
Patent number
07658988
Date of patent
February 9, 2010
Patent application number
11732344
Date Filed
April 3, 2007
Patent primary examiner
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