US Patent 7659146 Manufacturing method of semiconductor device

Patent 7659146 was granted and assigned to Renesas Technology Corp on February, 2010 by the United States Patent and Trademark Office.

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Patent Inventor Names

Tetsuharu Tanoue0

Date of Patent

February 9, 2010

Patent Application Number

11759290

Date Filed

June 7, 2007

Patent Primary Examiner

Patent abstract

Performing electrolysis plating to a wiring is made possible, aiming at the increasing of pin count of a semiconductor device.

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