Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 16, 2010
Patent Application Number
11191435
Date Filed
July 27, 2005
Patent Primary Examiner
Patent abstract
A method of forming a self-assembled interconnect structure is described. In the method, a contact pad surface and particles in a solution are brought together. The particles are selected such that they the particles adhere to the contact pad surface. Formation of a contact is completed by pressing an opposite contact into the particles such that an electrical connection is formed via the particles between the opposite contact pad and the substrate surface contact pad. The described self-assembled interconnect structure is particularly useful in display device fabrication.
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