US Patent 7663219 Semiconductor device and method of manufacturing the same
Patent 7663219 was granted and assigned to SAMSUNG ELECTRONICS CO., LTD. on February, 2010 by the United States Patent and Trademark Office.
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Patent abstract
A semiconductor device includes a semiconductor package, a circuit board and an interval maintaining member. The semiconductor package has a body and a lead protruded from the body. The circuit board has a first land electrically connected to the lead. The interval maintaining member is interposed between the circuit board and the body. The interval maintaining member maintains an interval between the lead and the first land. Thus, an interval between the lead and the land is uniformly maintained, so that a thermal and/or mechanical reliability of the semiconductor device is improved.
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US Patent 07663219 Semiconductor device and method of manufacturing the same US Patent 7663219 Semiconductor device and method of manufacturing the same
Infobox
Patent Number
0766321900
Patent Number
766321900
Edits on 25 Apr, 2023
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Infobox
Is a
Current Assignee
0
Patent Jurisdiction
Patent Number
076632190
Date of Patent
February 16, 2010
0Patent Application Number
119783700
Date Filed
October 29, 2007
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
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Infobox
Is a
Current Assignee
0
Patent Jurisdiction
Patent Number
076632190
Date of Patent
February 16, 2010
0Patent Application Number
119783700
Date Filed
October 29, 2007
0Official Website
Patent Primary Examiner
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US Patent 07663219 Semiconductor device and method of manufacturing the same
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07663219
Date of patent
February 16, 2010
Patent application number
11978370
Date Filed
October 29, 2007
Patent primary examiner
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