US Patent 7665509 Heat exchange module for electronic components

A heat exchange module (1) is disclosed, which includes an evaporator (20), a condenser (50) and a heat sink (22). The evaporator defines therein a chamber for containing a wick structure (20c) saturated with a working fluid. The wick structure occupies a portion of the chamber. The condenser is disposed adjacent to the evaporator, wherein the working fluid turns into vapor in the evaporator after absorbing heat of a heat-generating component and the vapor turns into condensate at the condenser after releasing the heat. The heat sink is attached to an outer surface of the evaporator and located in alignment with the wick structure contained in the evaporator.