US Patent 7666291 Method for fabricating metal wires

A method for fabricating metal wires is disclosed. A substrate is first provided, and a first metal layer is formed over the surface of the substrate. Next, a mask with patterns is formed on the surface of the substrate, in which the first metal layer is partially exposed. Next, an electroplating process is performed to form a second metal layer on top of the partially exposed first metal layer. Next, the mask with patterns is removed and an etching process is performed to remove part of the first metal layer by utilizing the second metal layer as a mask for forming a metal wire.