US Patent 7671519 Bond pad for use with piezoelectric ceramic substrates

A piezoelectric assembly includes a piezoelectric substrate that has a top surface, a bottom surface, and at least one side surface. A top electrode is defined on the top surface and a first aperture is defined in the top electrode. A bottom electrode is disposed on the bottom surface. The electrodes are formed from a thin film metal. A first thick film bond pad is disposed in the first aperture and is in contact with the piezoelectric substrate. The first thick film bond pad is in electrical contact with the top electrode. In further embodiments, a second thick film bond pad is disposed on either the top surface or in a second aperture defined in the bottom electrode.