US Patent 7672132 Electronic packaging apparatus and method
Patent 7672132 was granted and assigned to Intel on March, 2010 by the United States Patent and Trademark Office.
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Patent abstract
An electronic assembly includes a substrate, a device attached to the substrate, and a thermally conductive heat spreader covering the device and at least a portion of the substrate. A metal substantially fills the space between the device and the thermally conductive heat spreader. A method includes attaching at least one die to a substrate, placing a thermally conductive heat spreader over the die, and injecting a molten metal material into the space between the thermally conductive heat spreader and the die.
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US Patent 07672132 Electronic packaging apparatus and method US Patent 7672132 Electronic packaging apparatus and method
Infobox
Patent Number
0767213200
Patent Number
767213200
Edits on 26 Mar, 2023
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
076721320
Date of Patent
March 2, 2010
0Patent Application Number
115669920
Date Filed
December 5, 2006
0Official Website
Patent Primary Examiner
Edits on 24 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
076721320
Date of Patent
March 2, 2010
0Patent Application Number
115669920
Date Filed
December 5, 2006
0Official Website
Patent Primary Examiner
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US Patent 07672132 Electronic packaging apparatus and method
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07672132
Date of patent
March 2, 2010
Patent application number
11566992
Date Filed
December 5, 2006
Patent primary examiner
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