Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tomoyuki Kubo0
Date of Patent
March 9, 2010
0Patent Application Number
114263990
Date Filed
June 26, 2006
0Patent Primary Examiner
Patent abstract
In order to prevent stress caused by bending a flexible wiring board from being applied to the connection section between the flexible wiring board and a driving IC, solder is deposited as a reinforcement member, on both sides of the driving IC connected onto the flexible wiring board.
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