Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kazuma Sekiya0
Date of Patent
March 9, 2010
0Patent Application Number
121040880
Date Filed
April 16, 2008
0Patent Primary Examiner
Patent abstract
A wafer inspecting method including the steps of scanning the surface of a wafer along a street by using a line sensor having a plurality of elements arranged in a line, and determining a deposited condition of foreign matter on the surface of the wafer near electrodes formed on both sides of the street according to image information obtained by the above scanning step. By the use of the linear sensor, it is possible to efficiently determine whether or not the electrodes are good.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
