US Patent 7677902 Extended package substrate
Patent 7677902 was granted and assigned to Intel on March, 2010 by the United States Patent and Trademark Office.
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Patent abstract
An apparatus may include an integrated circuit package comprising a plurality of conductive pads and having a face, and a socket coupled to the integrated circuit package and to the conductive pads, the socket having a footprint. In some aspects, the footprint is smaller than the face.
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US Patent 07677902 Extended package substrate US Patent 7677902 Extended package substrate
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Patent Number
0767790200
Patent Number
767790200
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Official Website
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
076779020
Date of Patent
March 16, 2010
0Patent Application Number
118382900
Date Filed
August 14, 2007
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
076779020
Date of Patent
March 16, 2010
0Patent Application Number
118382900
Date Filed
August 14, 2007
0Official Website
Patent Primary Examiner
Edits on 18 Jun, 2022
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US Patent 07677902 Extended package substrate
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07677902
Date of patent
March 16, 2010
Patent application number
11838290
Date Filed
August 14, 2007
Patent primary examiner
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