Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Andrew McKerrow0
Ting Y. Tsui0
Satyavolu Srinivas Papa Rao0
Robert Kraft0
Date of Patent
March 16, 2010
0Patent Application Number
111969850
Date Filed
August 4, 2005
0Patent Primary Examiner
Patent abstract
The present invention provides a process for improving the hardness and/or modulus of elasticity of a dielectric layer and a method for manufacturing an integrated circuit. The process for improving the hardness and/or modulus of elasticity of a dielectric layer, among other steps, includes providing a dielectric layer having a hardness and a modulus of elasticity, and subjecting the dielectric layer to an energy beam, thereby causing the hardness or modulus of elasticity to increase in value.
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