US Patent 7679145 Transistor performance enhancement using engineered strains
Patent 7679145 was granted and assigned to Intel on March, 2010 by the United States Patent and Trademark Office.
All edits
Edits on 30 Oct, 2023
Golden AI
Edits made to:
Article (+270 characters)
Article
Patent abstract
A semiconductor substrate having metal oxide semiconductor (MOS) devices, such as an integrated circuit die, is mechanically coupled to a stress structure to apply a stress that improves the performance of at least a portion of the MOS devices on the die.
Edits on 25 May, 2023
Golden AI
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
Edits on 23 May, 2023
Golden AI
Edits made to:
Infobox (+1/-1 properties)
US Patent 07679145 Transistor performance enhancement using engineered strains US Patent 7679145 Transistor performance enhancement using engineered strains
Infobox
Patent Number
0767914500
Patent Number
767914500
Edits on 22 Mar, 2023
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
076791450
Date of Patent
March 16, 2010
0Patent Application Number
109302470
Date Filed
August 31, 2004
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
076791450
Date of Patent
March 16, 2010
0Patent Application Number
109302470
Date Filed
August 31, 2004
0Official Website
Patent Primary Examiner
Edits on 18 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
Edits on 4 Dec, 2021
Golden AI
Edits made to:
Infobox (+8 properties)
US Patent 07679145 Transistor performance enhancement using engineered strains
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07679145
Date of patent
March 16, 2010
Patent application number
10930247
Date Filed
August 31, 2004
Patent primary examiner
Find more entities like US Patent 7679145 Transistor performance enhancement using engineered strains
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
