US Patent 7682927 Method of manufacturing semiconductor device
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Patent abstract
A method for manufacturing a semiconductor device includes coating a solution containing a perhydrosilazane polymer on a substrate, heating the solution to form a film containing the perhydrosilazane polymer, and oxidizing the film in a water vapor atmosphere at a reduced pressure to convert the film into an insulating film containing silicon and oxygen.
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US Patent 07682927 Method of manufacturing semiconductor device US Patent 7682927 Method of manufacturing semiconductor device
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Patent Number
0768292700
Patent Number
768292700
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Patent Jurisdiction
Patent Number
076829270
Date of Patent
March 23, 2010
0Patent Application Number
113878540
Date Filed
March 24, 2006
0Official Website
Patent Primary Examiner
Edits on 27 Sep, 2022
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Infobox
Is a
Patent Jurisdiction
Patent Number
076829270
Date of Patent
March 23, 2010
0Patent Application Number
113878540
Date Filed
March 24, 2006
0Official Website
Patent Primary Examiner
Edits on 18 Jun, 2022
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US Patent 07682927 Method of manufacturing semiconductor device
Infobox
Is a
Patent jurisdiction
Patent number
07682927
Date of patent
March 23, 2010
Patent application number
11387854
Date Filed
March 24, 2006
Patent primary examiner
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