Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yukifumi Oyama0
Toshihiko Nishio0
Yasumitsu Orii0
Date of Patent
March 23, 2010
0Patent Application Number
118567690
Date Filed
September 18, 2007
0Patent Primary Examiner
Patent abstract
It is an object to reduce a thickness of a semiconductor component (chip) on a substrate to a predetermined thickness regardless of a variation in thickness of a substrate in a semiconductor product. In a semiconductor product mounted on a base plate, a surface of a semiconductor component on a substrate is set to be located at a predetermined height h from a surface of a base plate. Thereafter, through machining the surface of the semiconductor component which is adjusted to be located at the predetermined height, it is possible to make the thickness of the semiconductor component on the substrate equal to a predetermined thickness.
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