Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chang Hwa Chung0
Wei Ma0
Xunqing Shu0
Date of Patent
March 23, 2010
0Patent Application Number
121317880
Date Filed
June 2, 2008
0Patent Citations Received
0
...
Patent Primary Examiner
Patent abstract
There is described a hybrid bonding method for through-silicon-via based wafer stacking. Patterned adhesive layers are provided to join together adjacent wafers in the stack, while solder bonding is used to electrically connect the vias. The adhesive layers are patterned to enable outgassing and to provide stress relief.
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