Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
March 23, 2010
Patent Application Number
11768587
Date Filed
June 26, 2007
Patent Primary Examiner
Patent abstract
A semiconductor device is disclosed. One embodiment provides a device including a carrier, an electrically insulating layer arranged over the carrier and a first semiconductor chip arranged over the electrically insulating layer, wherein the first semiconductor chip has a first contact element on a first surface and a second contact element on a second surface.
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