Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hirofumi Nikaido0
Date of Patent
March 23, 2010
Patent Application Number
12071123
Date Filed
February 15, 2008
Patent Primary Examiner
Patent abstract
When a BGA package device is mounted to another substrate and tested for packaging strength, solder balls (8) frequently come detached in places where the edges of a semiconductor chip (1) align with the centers of the solder balls (8) on a BGA substrate (9) in the perpendicular direction of the substrate. In a semiconductor device of the present invention, the center of a semiconductor chip and the center of a BGA substrate to which the chip is mounted do not coincide with each other, and edges of the semiconductor chip do not align with the ball center positions on the BGA substrate in a direction perpendicular to the chip.
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