Patent 7684195 was granted and assigned to Siemens on March, 2010 by the United States Patent and Trademark Office.
A cooling system through which liquid flows for carrying away waste heat for electronics housings is particularly suited for the automotive industry. The cooling system is adapted to the dimensions of the housing. The novel device is the first to create an effective cooling system for electronics housings with and for a number of circuit board levels, yet with a space-saving compact design.