Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 30, 2010
Patent Application Number
11463855
Date Filed
August 10, 2006
Patent Primary Examiner
Patent abstract
An integrated circuit package system includes an arched pedestal integrated circuit die including an active surface, a die mounting surface, a pedestal portion including an arch intersecting the die mounting surface and having an arch height, and the arch under a portion of the active surface and having an arch width less than the arch height.
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