Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chau-Wen Cheng0
Ya-Ping Lin0
Chang-Yuan Wu0
Chi-Wei Tien0
Date of Patent
March 30, 2010
0Patent Application Number
121103360
Date Filed
April 27, 2008
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A thermal module suitable for cooling a heat generating element within a casing of an electronic apparatus includes a fan, a heat sink and a heat pipe. The fan is mounted within the casing for generating airflow to an opening of the casing. The heat sink is mounted within the casing between the opening of the casing and the fan, such that the airflow generated by the fan passes through the heat sink and then flows out of the opening. The heat pipe contacts the heat generating element, extends from the heat generating element to the heat sink, and extends along a periphery of the fan to contact the heat generating element again.
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