US Patent 7691676 Mold array process for semiconductor packages
Patent 7691676 was granted and assigned to Powertech Technology on April, 2010 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
November 14, 2008
Date of Patent
April 6, 2010
Patent Application Number
12271435
Patent Citations Received
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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