Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
April 6, 2010
Patent Application Number
11301470
Date Filed
December 12, 2005
Patent Primary Examiner
Patent abstract
An embodiment of the present invention is a technique to fabricate a package substrate. The package substrate includes top substrate layers, an array capacitor, and bottom substrate layers. The top substrate layers embed micro-vias. The micro-vias have a micro-via area and provide electrical connections between the top substrate layers. The array capacitor structure is placed in contact with the micro-via area. The array capacitor structure is electrically connected to the micro-vias. The bottom substrate layers are formed on the array capacitor structure.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
