Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
April 6, 2010
Patent Application Number
11819272
Date Filed
June 26, 2007
Patent Primary Examiner
Patent abstract
A semiconductor package facilitates package connection due to different locations of input/output pads in each interlayer die depending on coding information in a multi-chip package. The semiconductor package includes many chips. Each of the chips includes: input/output pads configured to input and output data having a given bandwidth; a decoding pad configured to receive coding information; and a code control unit configured to decode the coding information and to enable an input/output pad positioned at a specific location among the input/output pads according to the decoding result.
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