Is a
Patent attributes
Current Assignee
0
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kyu Youn Hwang0
Chin Sung Park0
Date of Patent
April 13, 2010
0Patent Application Number
115523350
Date Filed
October 24, 2006
0Patent Primary Examiner
Patent abstract
A method of forming a photoresist pattern, capable of improving an adhesion property of the photoresist pattern formed on a substrate, includes forming a photocatalytic layer on a substrate, forming a negative-type photoresist layer on the photocatalytic layer, exposing the photoresist layer to ultraviolet rays, heat-treating the photoresist layer, and developing the photoresist layer to form the photoresist pattern. Thereby, applying the photocatalytic layer formed on various substrates, the photoresist pattern has excellent adhesion property and is capable of ensuring a high aspect ratio.
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